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Micrometer wire of diamond 150 (silicon wafer slicing)
1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high. 2. Lost of kerf is low with high capacity....
Micrometer wire of diamond 310-350 (silicon wafer cutting and root)
1. Diamond is well- packaged; sharpness is good. 2. Cutting speed is fast, capacity is high with low cost. 3. Advanced and stable...
Micrometer wire of diamond 250 (sapphire slicing)
1. Diamond is well-distributed and packaged. 2. Substrate cutting for LED sapphire is efficient and fast. 3. Quality is stable wi...
Micrometer wire of diamond 120 (silicon crystal slicing)
1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high. 2. Lost of kerf is low with high capacity....
Wire saw of resin diamond 100 μm
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond 120 μm
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond 140 μm
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond 160 μm
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...